Flexible printed circuit
“Spring lock”

HSPL

One or two sides pre-treated and low-shrinkage heat-stabilised films guaranteeing exceptional dimensional stability and very good anchorage for adhesives and lacquers. Ideal application fields:
- TFM, Thin Flexible Microelectronics
- RFID, Radio Frequency Identification inlets
- FPC, Flexible Printed Circuits
- MTS, Membrane Touch Switches
- Electro-Luminescent Surfaces

Trade references Description Available thicknesses (µ)
HSPL00/HP00TSL One or two sides pre-treated and heat-stabilised clear film 23,36,50,75,100,125,175
HSPL20/HP20TSL One or two sides pre-treated and heat-stabilised slightly hazy film 23,36,50,75,100,125,175
HSPL80/HP80TSL One or two sides pre-treated and heat-stabilised medium hazy film 23,36,50,75,100,125,175
HSPL100/HP100TSL One or two sides pre-treated and heat-stabilised totally hazy film 23,36,50,75,100,125,175

Notes:
- Other thicknesses on request.
- Inside core : 3" or 6" on request (76 or 152 mm).
- MD: Machine Direction.

Kemafoil® is a registered trade mark of Coveme