TSL

Kemafoil® TSL is a polyester substrate with extremely low shrinkage value thanks to Coveme's heat stabilization process. As a result it is the ideal support for printing processes with high temperature curing.
Kemafoil® TSL is employed for the manufacturing of:

• RFID Radio Frequency Identification inlets
• FPC Flexible Printed Circuits
• MTS Membrane Touch Switches
• Electro-Luminescent Surfaces

Notes:
- Other thicknesses on request.
- Inside core : 3" or 6" on request (76 or 152 mm).
- MD: Machine Direction.

Kemafoil® is a registered trade mark of Coveme