Contacts:

Mrs Anne Steinmetz

EMail contact:

asteinmetz@coveme.com
Flexible printed circuit
"Spring lock"

HSPL-W

One or two sides pre-treated and low-shrinkage heat-stabilised films guaranteeing exceptional dimensional stability and very good bonding for adhesives and lacquers. Ideal application fields:
- RFID, Radio Frequency Identification
- FPC, Flexible Printed Circuits
- FFC, Flat Flexible Cable
- MTS, Membrane Touch Switches

Trade references Description Available thicknesses (µ)
HSPLW 20 HPW20TSL One or two sides pre-treated and heat-stabilised white opaque film 50,75,100,125,175,250,330
HSPLW 80 HPW80TSL One or two sides pre-treated and heat-stabilised medium white opaque film 50,75,100,125,175,250,330
HSPLW 100 HPW100TSL One or two sides pre-treated and heat-stabilised white opaque film 50,75,100,125,175,250,330

Notes:
- Other thicknesses on request.
- Inside core : 3" or 6" on request (76 or 152 mm).
- MD: Machine Direction.

Kemafoil® is a registered trade mark of Coveme